发明名称 Wafer scale lens module and manufacturing method thereof
摘要 There are provided a wafer scale lens module and a manufacturing method thereof. A wafer scale lens module including: at least one lens including a lens substrate and a lens element deposited on at least one surface of the lens substrate, wherein a stop is integrally formed on at least one surface of the lens to adjust light amount. The stop may be a photo resist layer. The wafer scale lens module is lighter in weight and smaller in size and has a stop formed of a photo resist which is excellently bonded to a UV curing polymer, thereby precluding a need for forming an additional bonding film. The stop can be fabricated only through an exposure process due to characteristics of the photo resist, thereby saving manufacturing costs and time.
申请公布号 US2008113273(A1) 申请公布日期 2008.05.15
申请号 US20070979743 申请日期 2007.11.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 JIN YOUNG SU;OH HYE RAN;CHANG IN CHEOL
分类号 G03F1/00;G03C1/72 主分类号 G03F1/00
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