发明名称 |
Wafer scale lens module and manufacturing method thereof |
摘要 |
There are provided a wafer scale lens module and a manufacturing method thereof. A wafer scale lens module including: at least one lens including a lens substrate and a lens element deposited on at least one surface of the lens substrate, wherein a stop is integrally formed on at least one surface of the lens to adjust light amount. The stop may be a photo resist layer. The wafer scale lens module is lighter in weight and smaller in size and has a stop formed of a photo resist which is excellently bonded to a UV curing polymer, thereby precluding a need for forming an additional bonding film. The stop can be fabricated only through an exposure process due to characteristics of the photo resist, thereby saving manufacturing costs and time.
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申请公布号 |
US2008113273(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20070979743 |
申请日期 |
2007.11.07 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JIN YOUNG SU;OH HYE RAN;CHANG IN CHEOL |
分类号 |
G03F1/00;G03C1/72 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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