LASER BEAM MACHINING METHOD, AND MULTILAYER CERAMIC SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a laser beam machining method for forming a sufficient through hole in a substrate of a multilayer structure, in which a resin carrier film is arranged on a green ceramic substrate having a high content rate of a glass component.

SOLUTION: In the laser beam machining method, the through hole 3 of the substrate in the multilayer structure where the carrier film 1 consisting of a resin material is formed on an upper face of a green sheet 2 being the green ceramic substrate comprising a ceramic aggregate and the glass component. The through hole is formed in the substrate of the multilayer structure by giving a step for punching the carrier film 1 by using a first laser beam with good absorptivity with respect to the resin material for punching the carrier film 1 and a step for punching the green sheet 2 by using a second laser beam having good absorptivity with respect to the ceramic material and bad absorptivity with respect to the glass material.

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