| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film which satisfactorily suppresses the electromigration occurring at a connection part when it is bonded to an electronic material. SOLUTION: The adhesive film is an adhesive film comprising a curable resin composition, wherein when it is temporarily bonded to the surface of an indium tin oxide coating layer on a glass substrate by application of temperature and pressure under conditions including 60°C, 1 MPa, and 2 seconds, it develops a peel strength of 10 N/m or larger at 25°C, 55% RH, and a peeling speed of 50 mm/min, and when it is temporarily bonded to the substrate under the same conditions, and thereafter kept for 100 h in a high-temperature and high-humidity environment including 60°C and 90% RH, it develops a 90°peel strength (as defined above) of 10 N/m or larger. COPYRIGHT: (C)2008,JPO&INPIT
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