发明名称 |
Seed/AFM combination for CCP GMR device |
摘要 |
Improved CPP GMR devices have been fabricated by replacing the conventional seed layer (typically Ta) with a bilayer of NiCr on Ta, said seed being deposited on the NiFe layer that constitutes a magnetic shield. Additional improvement was also obtained by replacing the conventional non-magnetic spacer layer of copper with a sandwich structure of two copper layers with an NOL (nano-oxide layer) between them. A process for manufacturing the devices is also described.
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申请公布号 |
US2008112089(A1) |
申请公布日期 |
2008.05.15 |
申请号 |
US20080008151 |
申请日期 |
2008.01.09 |
申请人 |
HEADWAY TECHNOLOGIES, INC. |
发明人 |
LI MIN;HORNG CHENG T.;HAN CHERNG C.;LIU YUE;CHEN YU-HSIA;TONG RU-YING |
分类号 |
G11B5/127 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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