发明名称 Seed/AFM combination for CCP GMR device
摘要 Improved CPP GMR devices have been fabricated by replacing the conventional seed layer (typically Ta) with a bilayer of NiCr on Ta, said seed being deposited on the NiFe layer that constitutes a magnetic shield. Additional improvement was also obtained by replacing the conventional non-magnetic spacer layer of copper with a sandwich structure of two copper layers with an NOL (nano-oxide layer) between them. A process for manufacturing the devices is also described.
申请公布号 US2008112089(A1) 申请公布日期 2008.05.15
申请号 US20080008151 申请日期 2008.01.09
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 LI MIN;HORNG CHENG T.;HAN CHERNG C.;LIU YUE;CHEN YU-HSIA;TONG RU-YING
分类号 G11B5/127 主分类号 G11B5/127
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