| 发明名称 |
LEAD-FREE SOLDER PASTE, ELECTRONIC CIRCUIT BOARD USING LEAD-FREE SOLDER PASTE, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT BOARD |
| 摘要 |
<p>Disclosed is a lead-free solder paste composed of a solder powder and a flux (13) mixed with the solder powder. The solder powder is composed of a first base alloy powder (11) which is a first alloy in a powder form, and a second base alloy powder (12) which is a second alloy in a powder form having a component composition different from that of the first base alloy powder (11). The solder powder has two or more melting points.</p> |
| 申请公布号 |
WO2008056676(A1) |
申请公布日期 |
2008.05.15 |
| 申请号 |
WO2007JP71574 |
申请日期 |
2007.11.06 |
| 申请人 |
VICTOR COMPANY OF JAPAN, LIMITED;KOKI COMPANY LIMITED;NAKAJIMA, SHINSAKU;IRISAWA, ATSUSHI |
发明人 |
NAKAJIMA, SHINSAKU;IRISAWA, ATSUSHI |
| 分类号 |
B23K35/26;B23K1/00;B23K101/42;C22C12/00;C22C13/02;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
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