发明名称 SUBSTRATE DRYING METHOD AND SUBSTRATE DRYING APPARATUS
摘要 A method and an apparatus for drying a substrate are provided to improve dry performance by efficiently drying treatment liquid over the entire surface of a substrate, and save energy by reducing air and power used. In a substrate drying apparatus, transfer speed of a substrate(G) is controlled to first speed when a front end area(Ga) and a rear end area(Gb) of the substrate reach a predetermined position spouting air to the substrate, and controlled to second speed higher than the first speed after the front end area and the rear end area of the substrate pass the predetermined position.
申请公布号 KR20080042791(A) 申请公布日期 2008.05.15
申请号 KR20080041036 申请日期 2008.05.01
申请人 TOKYO ELECTRON LIMITED 发明人 SHINOZAKI KENYA;SADA TETSUYA;NAKAMITSU TAKASHI;TSURUTA SHIGETO
分类号 G02F1/13 主分类号 G02F1/13
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