| 摘要 |
A process and manufacturing system for manufacturing injection molded parts with integrated flexible printed circuit board ( 9 ), provided with a cover ( 39/47 ) of plastic, fixed in a recess ( 2 ) of a carrier strip ( 1 ) by projecting carrier elements ( 14, 15, 16, 17 ). A circuit board ( 9 ) fixed in the carrier strip ( 1 ) is inserted into the cavity ( 21 ) of first casting mold half ( 20 ) of an injection mold, held in position by the carrier elements ( 14 through 17 ). The cavity ( 21 ) of the first casting mold half is closed by a closing mold part, which has no cavity, including the printed circuit board ( 9 ), and the cavity ( 21 ) is filled with injection molding compound in a first casting operation. The closing mold part ( 35 ) is removed and replaced with a second casting mold half ( 45 ) with a cavity ( 46 ), which is filled with injection molding compound in a second casting operation. |
