A CHUCK FOR HEATING AND COOLING

摘要

A chuck having heating and cooling functions is provided to enhance efficiency in a manufacturing process by performing a heating operation and a cooling operation therein. A chuck includes a wafer loading unit(210) and a supporting unit for supporting the wafer loading unit. A wafer is loaded on the wafer loading unit. The wafer loading unit includes a heating path(215) and a cooling path(217). The supporting unit includes at least one heating line(235) and at least one cooling line(237). The heating line is used for supplying current to the heating path. The cooling line is used for transferring a cooling agent from the outside through the cooling path to the outside. The cooling path is positioned at an upper part of the heating path.