| 摘要 |
A dechucking device of a plasma etching apparatus and a dechucking method using the same are provided to raise uniformly a lift pin by forming a cylinder at a lateral surface of an electrostatic chuck. A plurality of pins(200a,200b) are formed to lift a wafer in a dechucking process. A plurality of air cylinders(201a,201b) are mounted under the lift pins in order to move the corresponding lift pins. An air cylinder control unit detects states of the lift pins and controls the air cylinders by adjusting the amount of air to be supplied to the air cylinders according to the detected results. The air cylinder control unit includes an air supply unit(202a,202b) for supplying the air to the air cylinders and an air amount control unit(203) for detecting the information about the lift pins and adjusting the amount of air according to the detected result.
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