发明名称 ADHESIVE RESIN COMPOSITION AND MULTILAYER BODY
摘要 <p>An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided. The composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin). Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of ±-olefins excluding propylene of 20% by weight or higher.</p>
申请公布号 EP1921110(A1) 申请公布日期 2008.05.14
申请号 EP20060797319 申请日期 2006.09.01
申请人 MITSUBISHI CHEMICAL CORPORATION 发明人 IKEDA, CHIKAKO
分类号 C08L23/10;B32B27/32;C09J123/14 主分类号 C08L23/10
代理机构 代理人
主权项
地址
您可能感兴趣的专利