| 摘要 |
A substrate chuck is provided to simplify the structure and installation of a substrate chuck by using a simple structure without an electrical interconnection. An adhesion layer(3,5) is formed on a base(6), repeatedly attaching a substrate by an adhesion characteristic. The adhesion layer can be silicon adhesive, having a thickness of 12.5-300 mum wherein a strength reinforcing layer(4) is interposed between the adhesion layer and the base to reinforce the strength of the adhesion layer. An adhesive layer can be interposed between the base and the strength reinforcing layer to attach the strength reinforcing layer to the base.
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