MOUNTING METHOD OF CHIPS OR STRAPS ON A TRANSPARENT SUBSTRATE USING TRANSMITTING ULTRAVIOLET

摘要

A method for mounting a chip or a strap on a transparent substrate is provided to enable an adhesive agent to be quickly cured by mounting the chip using UV curing paste. A conductive pattern is formed on a transparent substrate(10). A transmissive window is formed on a bonding portion, on which a chip(100) or a strap is mounted. The conductive pattern is formed, such that a UV(Ultra-Violet) ray is irradiated thereon through the transmissive window. UV curing paste(30) is applied on the transmissive window. The chip or the strap is aligned on the transmissive window of the bonding portion, and the chip or strap is pressed on the transmissive window. When the chip or strap is aligned, the UV ray is irradiated on transmissive window through the transparent substrate, such that the UV curing paste is cured.