发明名称 Vorrichtung zur Montage von Stiften auf einer Leiterplatte
摘要 #CMT# #/CMT# The device has a body (20), which positively receives each end of the pins (12) spaced from the printed board in the direction of axis of the pins and in form fitting manner against tilting of the axis of the pins. The body is pulled out after assembling the pins and the suction surface (26) is formed at the body. The surface is spaced from the pins, is formed. The body possesses bushing (22) for a griping admission of the pins. #CMT#USE : #/CMT# Device for assembling an array of pins, which are spaced from each other for electrical contact on a printed board with an insulation body (Claimed). #CMT#ADVANTAGE : #/CMT# The device has a body, which positively receives each end of the pins spaced from a printed board in the direction of axis of the pins and in form fitting manner against tilting of the axis of the pins. The body is pulled out after assembling the pins and a suction surface is formed at the body, and hence ensures economical and simple printed board, reduced manufacturing expenditure, reduced space requirement for the patch cord, and reliable contacting of the printed circuit board. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a perspective view of a pins array assembling device. 12 : Pins 18 : Stop shoulder 20 : Body 22 : Bushing 24 : Slot 26 : Suction surface.
申请公布号 DE102006030135(B4) 申请公布日期 2008.05.08
申请号 DE20061030135 申请日期 2006.06.28
申请人 MC TECHNOLOGY GMBH 发明人 BORST, JOACHIM
分类号 H05K13/04;B65G47/91;H05K3/32 主分类号 H05K13/04
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