| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module which is made thin and is improved in heat dissipation property, and to provide its manufacturing method. SOLUTION: A groove 2d, which runs through between a pair of opposite side faces 2g and 2f, is formed in an insulation substrate 2, and an electronic component 5 is stored in the groove 2d. Thus, by storing the electronic component 5 in the groove 2d, the electronic component module 1 can be made thin. Moreover, since the electronic component 5 is exposed outside on the side faces 2g and 2h with the groove 2d formed, the heat dissipation property of the electronic component 5 can be improved. COPYRIGHT: (C)2008,JPO&INPIT
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