发明名称 |
Fuse structures and integrated circuit devices |
摘要 |
Fuse structures and integrated circuit devices are disclosed. An exemplary embodiment of a fuse structure comprises a first and second metal pads formed at different positions in a first dielectric layer and a conductive line formed in a second dielectric layer underlying the first dielectric layer, electrically connecting the first and second pad. The conductive line is formed with at least one first portion at an end thereof and a second portion connected with the first portion, wherein the width of the first portion is greater than the width of the second portion.
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申请公布号 |
US2008105948(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20060592216 |
申请日期 |
2006.11.03 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
JENG SHIN-PUU;WU ANBIARSHY |
分类号 |
H01L29/00 |
主分类号 |
H01L29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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