发明名称 TRANSMISSION PATH, WIRING BOARD HAVING THE SAME AND SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To adjust a transmission loss by appropriately controlling the cross-sectional structure of a transmission path in a wiring board connected to a multi-pin high speed LSI. <P>SOLUTION: In the multi-layer wiring board, where every signal wiring is arranged in different two wiring layers and a plurality of differential pairs are formed so as to be shifted with fixed distances in a horizontal direction so that they can be prevented from being vertically overlapped with each other, when the shifting quantity of the two signal wiring in the horizontal direction is defined as d, and the thickness of an insulating layer separating the two signal wiring is defined as t, and the sum of a wiring cycle with adjacent signal wiring, that is, the interval with the adjacent differential wiring and the signal wiring width is defined as p, there is a section where a value D shown by D=d(t/p<SP>3</SP>)<SP>1/2</SP>falls within the range of 0.2<D<1,2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008109331(A) 申请公布日期 2008.05.08
申请号 JP20060289462 申请日期 2006.10.25
申请人 NEC CORP;TOKYO INSTITUTE OF TECHNOLOGY 发明人 SAKAI ATSUSHI;KOUDA HIKARI;EKI KAZUYA;OKADA KENICHI;KIMURA SANETO
分类号 H01P3/04;H01L23/12 主分类号 H01P3/04
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