| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit package system which enhances thermal dissipation behavior and reduces installation area. <P>SOLUTION: The integrated circuit package system 100 or 200 comprises: a means for imparting an electric interconnection system 116 including a first lead finger system 118 and a second lead finger system 120; a means for connecting a first device 102 to the first lead finger system 118 at wire bonding 122; a means for accumulating a second device 104 connecting to the first device 102; and a means for connecting the second device 104 to the second lead finger system 120 at a bump junction 124. <P>COPYRIGHT: (C)2008,JPO&INPIT |
