| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection which is excellent in moldability and can form a cured product having light reflection properties which is less prone to deterioration, and to provide an optical semiconductor element loading substrate and its manufacturing method, as well as an optical semiconductor device. <P>SOLUTION: This thermosetting resin composition for light reflection comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C), a white pigment (D) and a coupling agent (E), wherein the curing agent (B) comprises cyclohexane tricarboxylic anhydride, the cured resin has a photoreflectance of ≥90% at a wavelength of 800-350 nm, and the resin before curing can be pressure molded at a room temperature (0-35°C). The optical semiconductor element loading substrate using it and its manufacturing method are disclosed. The optical semiconductor device using it is also disclosed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
