| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve electronic equipment capable of aiming at gaining both of a satisfactory hollow state in the clearance between a substrate and an electronic component and high airtightness without reducing productivity. <P>SOLUTION: The electronic equipment 10 has: a packaging substrate 11; the electronic component 13 packaged onto the packaging substrate 11; and a resin film 15 provided over the entire surface of the packaging substrate 11 while covering the electronic component 13. The resin film 15 has a shear viscosity s of not less than 150 kPa s and a flow amount of not less than 100 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
