METHOD OF PACKAGING ELECTRONIC COMPONENT ON SUBSTRATE AND METHOD OF FORMING SOLDER FACE

摘要

PROBLEM TO BE SOLVED: To inexpensively provide a smoothed solder face constituted of Au-Sn eutectic alloy, suitable for packaging an electronic component when packaging the electronic component on the solder face of a substrate.

SOLUTION: A method of packaging an electronic component onto a substrate includes: forming an Au bump (24) on an electrode face (20) of a substrate (10); packaging an Sn solder sheet (26) on the Au bump; applying a reflow to these Sn solder sheet and Au bump to obtain an Au-Sn eutectic alloy (28); smoothing the eutectic alloy; and bonding the electronic component (30) on a surface of the smoothed eutectic alloy.

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