| 摘要 |
PROBLEM TO BE SOLVED: To uniformize a signal delay time of each of through electrode wirings. SOLUTION: A semiconductor device 101 comprises a plurality of semiconductor chips 102a, 102b. The semiconductor chips 102a, 102b are each provided with a plurality of through electrodes 106 (106a or 106b), and the through electrodes 106 are electrically connected to input-output terminals 103 via through electrode wirings 110, 111 coupled along a laminate direction. At least one part of the through electrodes 106 is a through electrode for signal delay adjustment having a profile molded corresponding to the length of the through electrode wirings 110, 111 including this through electrode so that the signal delay time of each of the through electrode wirings 110, 111 can be equalized. COPYRIGHT: (C)2008,JPO&INPIT
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