Micromechanical z-acceleration sensor for e.g. safety system of motor vehicle, has planar jack connected with substrate by multiple arrangement of parallel running torsion springs, where acceleration to be measured acts on substrate

摘要

The sensor has a seismic mass in the form of a planar jack (1) and movable from a wafer plane. A deflection of the jack takes place in form of a rotating movement, so that a rotation axis lies in a plane of the jack. The jack is connected with a substrate (3) by multiple arrangement of parallel running torsion springs (2), where acceleration to be measured acts on the substrate. The torsion springs lie in a plane parallel to the wafer plane.