PAPER HAVING ENCLOSED IC TAG

摘要

PROBLEM TO BE SOLVED: To provide paper having an enclosed IC tag, which exhibits good adhesiveness between an IC tag inlet and paper layers and good appearance without faults such as unevenness.

SOLUTION: The paper having an enclosed IC tag is prepared by enclosing a non-contact IC tag inlet installed with at least an IC chip and an antenna on a base material between paper layers during paper making. The surface of the base material of the IC tag inlet has a wet tension of ≥45 mN/m measured according to JIS K 6768. It is preferable to coat the base material surface of the IC tag inlet with a hydrophilic material or to treat the surface with plasma or corona discharge.

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