发明名称 TO-RESIN ADHESIVE LAYER AND MANUFACTURING METHOD OF LAMINATE USING IT
摘要 PROBLEM TO BE SOLVED: To provide a to-resin adhesive layer and a manufacturing method of a laminate using it capable of ensuring excellent adhesiveness between resin and copper or copper alloy, of preventing ion migration because of dendrite that is a problem in a prior art tin or tin alloy layer from happening, and of improving also adhesiveness with high glass transition point (Tg) resin. SOLUTION: The to-resin adhesive layer of the present invention is a to-resin adhesive layer comprised of resin and copper or copper alloy for adhering resin with a copper or copper alloy layer. The to-resin adhesive layer is formed with a coral shaped structure metal layer where many copper or copper alloy particles aggregate with gaps existent therebetween and with a plurality of pores existent on the surface. The average diameter of the pores is in a range of 10 nm to 200 nm and the pores are existent by 2 or more in average per 1μm<SP>2</SP>of the metal layer surface. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008109111(A) 申请公布日期 2008.05.08
申请号 JP20070243915 申请日期 2007.09.20
申请人 MEC KK 发明人 KAWAGUCHI MUTSUYUKI;SAITO TOMOSHI;DEGUCHI MASAFUMI;AMAYA TAKESHI
分类号 H05K3/38;B32B15/08 主分类号 H05K3/38
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