发明名称 |
PEAK-BASED ENDPOINTING FOR CHEMICAL MECHANICAL POLISHING |
摘要 |
A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship. |
申请公布号 |
WO2008055174(A2) |
申请公布日期 |
2008.05.08 |
申请号 |
WO2007US83045 |
申请日期 |
2007.10.30 |
申请人 |
APPLIED MATERIALS, INC.;BENVEGNU, DOMINIC J.;SWEDEK, BOGUSLAW A.;LISCHKA, DAVID J. |
发明人 |
BENVEGNU, DOMINIC J.;SWEDEK, BOGUSLAW A.;LISCHKA, DAVID J. |
分类号 |
C03C15/00;C23F1/00;G06F19/00;H01L21/306 |
主分类号 |
C03C15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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