| 摘要 |
A multilayer flexible printed wiring board and a method for manufacturing the same are provided to be suitable for high speed signal transmission by arranging low dielectric constant insulating layers around a signal line to reduce capacitance between the signal line and a plane layer and delay in the high speed signal transmission. A multilayer flexible printed wiring board includes first to third insulating layers(9,10,11) and a plane layer(12). The first insulating layer has a signal line(8) on one surface and is partially removed around the signal line. The second insulating layer is made of low dielectric constant material, has a thickness larger than a sum of the removed thickness of the first insulation layer and a thickness of the signal line, and exposes the signal line together with the first insulating layer. The third insulating layer is made of low dielectric constant material and faces the second insulating layer to surround the signal line. The plane layer is formed on the third insulating layer.
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