发明名称 Input stage of semiconductor device with multiple pads of common function, and multi-chip package having the same
摘要 An input stage of a semiconductor device includes at least two pads, input buffers, a current source, and a logic operation circuit. The at least two pads, to which the input buffers respectively correspond, perform a common function. The current source provides a current to the respective at least two pads so that a predetermined fixed logic value is outputted by the input buffers while the respective at least two pads have a floating status. The logic operation circuit performs a logic operation on signals applied to the respective at least two pads via the input buffers, and outputs a resultant value to an internal circuit. When the input end of the semiconductor is used in a multi-chip package, the internal circuit may not be affected by the other pads that are not bonded to external pins, even though only one pad is bonded to an external pin.
申请公布号 US2006180913(A1) 申请公布日期 2006.08.17
申请号 US20060352175 申请日期 2006.02.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE YOU-MI;JEONG WOO-SEOP
分类号 H01L23/02 主分类号 H01L23/02
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