发明名称 |
Composite layer method for minimizing PED effect |
摘要 |
A novel composite layer structure method which is suitable for reducing post-exposure delay (PED) effects associated with fabricating a photolithography reticle or mask and eliminating or at least minimizing variations between intended and realized critical dimension values for a circuit pattern fabricated on the reticle or mask. The method includes providing a mask blank having a metal layer, providing a photoresist layer on the metal layer of the mask blank, providing a protective layer on the photoresist layer and photo-cracking the photoresist layer in the desired circuit pattern typically by electron beam exposure. During subsequent post-exposure delay periods, the protective layer prevents or minimizes Q-time narrowing of the photo-cracked photoresist, and consequently, prevents or minimizes narrowing of the critical dimension of a circuit pattern etched in the metal layer according to the width of the photo-cracked photoresist.
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申请公布号 |
US7368229(B2) |
申请公布日期 |
2008.05.06 |
申请号 |
US20040835218 |
申请日期 |
2004.04.28 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN CHUN-LANG;TSAI FEI-GWO |
分类号 |
G03F7/20;G03F7/095;G03F7/26;G03F9/00;H01L21/027 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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