| 摘要 |
<p>It is described in different embodiments thereof a support (10; 20) for manufacturing microelectronic, microoptoelectronic or micromechanical device s requiring gas absorption for their correct operation, comprising a mechanica l supporting base (11; 21), a layer (13) of a gas absorbing material on the ba se and a layer for temporary protection of the gas absorbing material, that is removed during the manufacture of the devices.</p> |
