CERAMIC HEADER METHOD AND SYSTEM

摘要

A ceramic header (130) configured to form a portion of an electronic device package (20) includes a mounting portion configured to provide a mounting surface for an electronic device (150). In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface (138) of the ceramic header to a second surface (136) of the ceramic header. The ceramic header also includes one or more thermally polished surfaces (132) and (134).