| 摘要 |
<p>A substrate processing apparatus, method of adjusting a substrate delivery position, and a storage medium are provided to accurately measure a rotation center of a substrate support portion by using a centrifugal acceleration or an eccentricity distance between the rotation center and a measuring position. A jig(12) having a shape corresponding to a wafer to be processed is used for notifying a position of a substrate. A measuring unit(11) is attached to a center of the jig. A controller(31) controls an application unit and a development unit based on the data from the measuring unit. A unit controller and an arm controller control a spin chuck(2) in the application unit or main arms based on a control command from the controller. The measuring unit includes an acceleration sensor, a CPU(Central Processing Unit) for controlling the measuring unit, a program storage, an ADC(Analog Digital Converter), a buffer memory, an antenna, and a communication controller. The antenna wirelessly communicates with a controller in the development unit.</p> |
