| 摘要 |
PROBLEM TO BE SOLVED: To provide a strong bonding material suitable for combining semiconductor processing chamber components. SOLUTION: A bonding material which contains at least one adhesive composed of an acrylic compound and a silicon compound that is in a form of paste, glue, gel, or a pad, and includes at least one metal load material from AL, Mg, Ti, Ta, Y, and Zr is applied to the lower surface of a bonding material conductive base 194 or the top surface of a gas distribution plate 196, the top surface of the base 164 and the lower surface of an electrostatic chuck 166, and thus, the material is used for manufacturing the semiconductor processing chamber components. COPYRIGHT: (C)2008,JPO&INPIT
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