发明名称 |
Adhesive for Production of Ic Card, Process for Producing Ic Card, and Ic Card |
摘要 |
A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
|
申请公布号 |
US2008102268(A1) |
申请公布日期 |
2008.05.01 |
申请号 |
US20060883132 |
申请日期 |
2006.01.26 |
申请人 |
HIGASA KOICHIRO;ITO YOSHINORI;OOTA MASAHIKO;IGARASHI YOSHINORI |
发明人 |
HIGASA KOICHIRO;ITO YOSHINORI;OOTA MASAHIKO;IGARASHI YOSHINORI |
分类号 |
B32B27/40;B32B5/00;B32B38/04;C08G18/00 |
主分类号 |
B32B27/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|