| 摘要 |
PROBLEM TO BE SOLVED: To provide a separation film capable of performing hot press lamination without losing a space in a multilayer interconnection board complex and capable of achieving improved electrical connection via hot press lamination and a via hole by applying pressure entirely and uniformly. SOLUTION: A bonding sheet constituted by having a resin layer composed of a mixed composition including the via hole, an opening, and a prescribed resin mixture is arranged between two multilayer wiring boards composed of a thermosetting resin compositions, and are subjected to hot press, and the two multilayer wiring boards are connected each other by the via hole electrically. The separation film is arranged outside the multilayer wiring boards in the hot press lamination when the multilayer wiring board complex in which the space is formed inside is manufactured for use. The separation film has an extended polyester film and a fluororesin layer laminated on the film. In the separation film, the side of the fluororesin layer is arranged at the side of the multilayer wiring board for use. COPYRIGHT: (C)2008,JPO&INPIT |
