发明名称 METHOD FOR CONTROLLING MICROSTRUCTURE VIA THERMALLY MANAGED SOLID STATE JOINING
摘要 A method for creating a solid state joint is disclosed. The method includes providing an adjoining apparatus that includes a pin tool, a backing plate and a thermal control plate disposed below the backing plate. The method also includes rotating the pin tool and traversing the pin tool relative to a workpiece along a joint to be welded on the workpiece. The method further includes manipulating the temperature of the pin tool and the backing plate in order to control the temperature and rate of change of temperature experienced by the workpiece at a weld affected zone at the joint. The method also includes maintaining a user chosen temperature differential between the weld affected zone and the backing plate via the thermal control plate.
申请公布号 US2008099533(A1) 申请公布日期 2008.05.01
申请号 US20060554751 申请日期 2006.10.31
申请人 GENERAL ELECTRIC 发明人 HANLON TIMOTHY;SUBRAMANIAN PAZHAYANNUR RAMANATHAN;HELDER EARL CLAUDE;TRAPP TIMOTHY JOSEPH
分类号 B23K20/12 主分类号 B23K20/12
代理机构 代理人
主权项
地址