| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, an electronic device, and their manufacturing methods. <P>SOLUTION: The semiconductor device includes a semiconductor substrate 10 having electrodes 12, resin protrusions 20 formed on a surface 15 whereon the electrodes 12 of the semiconductor substrate 10 are formed, and wiring 30 connected electrically with the electrodes 12 each of which comprises an electrically connective portion 32 disposed on each resin protrusion 20 and a first metal layer 34 and a second metal layer 36 so formed as to cover the first metal layer 34. Shapes of projection drawings of the first and the second metal layers 34, 36 which are projected on the semiconductor substrate 10 are different from each other in an overlapping region with each resin protrusion 20. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
