发明名称 FILM PUNCHING METHOD AND PUNCHED FILM
摘要 PROBLEM TO BE SOLVED: To provide a film punching method for punching a film to be punched having a small initial tensile stress (at the time of 1%-elongation) so as to have pores of predetermined shapes continuously without distortion. SOLUTION: According to the film punching method, a laminated film is obtained by laminating a carrier film on the film to be punched via a water-easily-soluble adhesive layer, to reinforce the film so as to have a breaking stress of 80 N/15 mm width or more, a breaking elongation of 155% or less, and the initial tensile stress (at the time of 1%-elongation) of 8 N/15 mm width or more. Then the laminated film thus reinforced is punched, and thereafter the carrier film layer is separated and removed. Herein the separation and removal is preferably carried out by water submersion. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008100327(A) 申请公布日期 2008.05.01
申请号 JP20060286104 申请日期 2006.10.20
申请人 PANAC CO LTD 发明人 KATAOKA HIROYASU;AGATA HAYATO;SUMINOUE SHIGEAKI;ICHIYANAGI MAKOTO
分类号 B26F1/00;B32B7/06 主分类号 B26F1/00
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