| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a resist film of a thicker film in a method and a device for painting resist liquid atomized by a rotary atomization head to a printed circuit board conveyed by a conveyor and forming the solder resist film. <P>SOLUTION: In the painting method of resist liquid of the printed wiring board, a face of the printed wiring board 18 where a prescribed wiring pattern is formed is made vertical and resist liquid atomized by the rotary atomization head 14 going up and down facing the face is electrostatically painted on the face of the printed wiring board. The painted face is air-dried after a surface of the printed wiring board 18 is painted with resist liquid. Resist liquid is superimposed and painted on the air-dried painted face by such a method. It is desirable that a plurality of atomization heads rotating around a perpendicular axis are arranged in a direction parallel to a conveyance path of the printed wiring board at prescribed intervals. <P>COPYRIGHT: (C)2008,JPO&INPIT |
