| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of semiconductor device which easily connects a bonding wire to an electric connection terminal provided on the upper surface of a semiconductor chip, and enhances the connection reliability of the bonding wire. SOLUTION: The manufacturing method of the semiconductor device 1 comprises processes of: forming an adhesive agent layer 4 consisting of light-and-curing adhesive agent on the lower surface 2b of the semiconductor chip 2 or the upper surface 3a of a supporting member 3; progressing the curing of the adhesive agent layer 4 by irradiating light against the adhesive agent layer 4; laminating the semiconductor chip 2 on the upper surface 3a of the supporting member 3 through the adhesive agent layer 4; and connecting bonding wires 6a, 6b to the electric connection terminals 5a, 5b provided on the upper surface 2a of the semiconductor chip 2 when the curing of the adhesive agent layer 4 has been progressed so that the gel constituent ratio of the adhesive agent layer 4 is not less than 20%. COPYRIGHT: (C)2008,JPO&INPIT
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