Systems, devices, components and methods for hermetically sealing electronic modules and packages

摘要

Disclosed are various embodiments of systems, devices and methods for forming an hermetic seal between a lid and a submount for an electronics module or package. At least one thieving pad is connected to a metallized ring formed about or near the circumference of an upper surface of the submount. A corresponding metallized ring is disposed about the lower perimeter of the lid. Solder paste is placed between the two metallized rings and melted, preferably under a reducing atmosphere. Excess molten solder controllably flows towards the at least one thieving pattern while the lid is being hermetically sealed and soldered, avoiding the formation of undesired wayward solder balls inside the package.