发明名称 METHOD FOR MANUFACTURING PHASE-CHANGE MEMORY ELEMENT, AND METHOD FOR FORMING PHASE-CHANGE LAYER APPLIED TO THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a phase-change memory element, and to provide a method for forming a phase change layer applied to the same. SOLUTION: The method for manufacturing a phase-change memory element including a step that supplies a bivalent first precursor, containing germanium (Ge) onto a lower film, where the phase-change layer is formed is provided. The phase-change layer is formed with one method among MOCVD, cyclic-CVD and ALD; in this case, the composition of the phase-change layer can be controlled by pressure, deposition temperature or reaction gas supplied amount; and the pressure scope may be 0.001 Torr to 10 Torr, the deposition temperature scope can be 150°C to 350°C, and the reaction gas supplied amount can be 0 to 1 slm. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103731(A) 申请公布日期 2008.05.01
申请号 JP20070273033 申请日期 2007.10.19
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 SHIN WOONG-CHUL;LEE JAE-HO;KANG YOUN-SEON
分类号 H01L27/105;C23C16/18;H01L45/00 主分类号 H01L27/105
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