发明名称 Thin, passive cooling system
摘要 A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.
申请公布号 US2008101026(A1) 申请公布日期 2008.05.01
申请号 US20060591926 申请日期 2006.11.01
申请人 ALI IHAB A 发明人 ALI IHAB A.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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