发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thick liner film where stress is applied to a channel region, and to securely form a contact with respect to a source region and a drain region in a semiconductor device having a MOS transistor. SOLUTION: The semiconductor device is provided with the MOS transistor which is formed on a substrate 100 and has a channel region, a gate insulating film 102, a gate electrode 103, the source region, and the drain region 105. The device is also provided with: the liner film 122 which covers the gate electrode 103, the source region and the drain region 105, and applies stress to the channel region; and a contact plug 111 connected to the gate electrode 103, the source region, or the drain region 105. A cross section in a part above an upper face of the liner film 122 of the contact plug 111 is larger than that in a part below the upper face of the liner film 122 of the contact plug 111. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008103504(A) 申请公布日期 2008.05.01
申请号 JP20060284167 申请日期 2006.10.18
申请人 MATSUSHITA ELECTRIC IND CO LTD;RENESAS TECHNOLOGY CORP 发明人 KAGAWA KAZUHIRO;ENDO KENICHI;MIYAGAWA YOSHIHIRO
分类号 H01L29/78;H01L21/28;H01L21/768;H01L21/8234;H01L21/8238;H01L23/522;H01L27/088;H01L27/092 主分类号 H01L29/78
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