| 摘要 |
PROBLEM TO BE SOLVED: To exchange a front-side electrode plate with a simple arrangement and further reduce cost in a shower head for a semiconductor processing apparatus. SOLUTION: A shower head 30 includes a rear-side electrode plate 32 having a gas inlet hole 38, a buffer material 34 having a through hole 40, and a front-side electrode plate 36 having a gas blowoff hole 42. The front-side electrode plate is removably mounted via the buffer material 34 by means of mounting screws 80 at three central mounting positions and at six outer-periphery mounting positions. With such an arrangement, the gas inlet hole 38, the through hole 40, and the gas blowoff hole 42, which correspond with each other, form a gas supply through hole. At the outer-periphery mounting positions, washers 82, 84 are provided as stress absorbing members between the rear-side electrode plate 32 and the mounting screws 80. The stress absorbing action of the washers 82, 84 absorbs a misalignment between the rear-side electrode pate 32 and the front-side electrode plate 36 at the outer periphery due to a difference in thermal expansion coefficient therebetween. Thus the front-side electrode plate 36 can also be mounted upside down on the rear-side electrode plate 32. COPYRIGHT: (C)2008,JPO&INPIT
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