| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which exhibits a good adhesion and has a low modulus and a semiconductor device which is excellent in reliability such as solder crack resistance by using the resin composition for the die attachment material for a semiconductor device or the adhesive material for a heat dissipation member. SOLUTION: The resin composition comprises (A) a compound expressed by general formula (1) (wherein, R<SP>1</SP>, R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each any of hydrogen, a methyl group and an ethyl group; G is a glycidyl group) as an essential component. The semiconductor device is manufactured by using the resin composition for the die attachment material or the adhesive material for heat dissipation materials. COPYRIGHT: (C)2008,JPO&INPIT
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