| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation resin composition having a high insulation reliability in the case of using it as the insulation resin composition of a laminated plate, having flame retardance and capable of performing a high density, highly multiple-layered molding, and a prepreg, laminated plate and a semiconductor device by using the same. SOLUTION: This insulation resin composition is characterized by having≥6 and≤50 ppm/°C linear expansion coefficient at 25°C, containing (a) a metal hydroxide having≥10 and≤500 ppm concentration of metal ionic impurities and (b) a novolac type epoxy resin and also containing a not substantially halogenated epoxy resin. The prepreg is characterized by using the above insulation resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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