发明名称 Cooling Device and Electronic Device
摘要 According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.
申请公布号 US2008101017(A1) 申请公布日期 2008.05.01
申请号 US20070845634 申请日期 2007.08.27
申请人 HATA YUKIHIKO;ISHIKAWA KENICHI 发明人 HATA YUKIHIKO;ISHIKAWA KENICHI
分类号 H05K7/20 主分类号 H05K7/20
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