发明名称 WAFER LEVEL METHOD OF LOCATING FOCAL PLANE OF IMAGER DEVICES
摘要 A method is disclosed which includes providing an imager substrate comprised of at least one imager device, providing a transparent substrate, forming a plurality of standoff structures on one of the imager substrate and the transparent substrate, the standoff structures having a width, forming an adhesive material having an initial thickness on a surface on at least one of the standoff structures, the adhesive material having an initial width that is less than the width of the standoff structures, and urging one of the imager substrate and the transparent substrate toward the other until such time as the imager substrate and the transparent substrate are in proper focal position relative to one another, the urging causing the initial thickness of the adhesive material to be reduced to a final thickness that is less than the initial thickness.
申请公布号 US2008102552(A1) 申请公布日期 2008.05.01
申请号 US20060554243 申请日期 2006.10.30
申请人 FARNWORTH WARREN 发明人 FARNWORTH WARREN
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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