| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for applying a solder paste capable of adequately conducting a soldered joint without a bridge or an unsoldered joint, and to provide an electronic circuit board with an appropriate soldered joint conducted. SOLUTION: The method for applying the solder paste for the connection of a surface mount component to the electronic circuit board 1 by the reflow method comprises a step of partially applying the solder paste 3 to at least a crossover region with a terminal on the surface of the land 2 for component terminal connection on the electronic circuit board 1. COPYRIGHT: (C)2008,JPO&INPIT |
