| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder raw material having a low melting point and uniform particle sizes. SOLUTION: Regarding the treatment method for a lead-free solder alloy, using atomic hydrogen generated by a hot wire process, a lead-free solder alloy is subjected to reduction and etching. In the other mode, by a hot wire process, a lead-free solder alloy is treated with a nitrogen compound, so as to form a thermally instable nitride film on the surface thereof. COPYRIGHT: (C)2008,JPO&INPIT
|
